Electronic Datasheet  
Transistors
 
2N...   2SA...  
2SB...   2SC...  
2SD...   2SJ...  
2SK...
2N1613   2N1711  
2N2955   2N3019  
2N3055   2N3439  
2N3440   2N3771  
2N3772   2N3904  
2N3906   2N4124  
2N4126   2N4401  
2N4403   2N4920  
2N5038   2N5088  
2N5154   2N5191  
2N5192   2N5195  
2N5339   2N5400  
2N5401   2N5415  
2N5416   2N5550  
2N5551   2N5657  
2N5680   2N5681  
2N5884   2N5886  
2N6036   2N6039  
2N6050   2N6059  
2N6107   2N6111  
2N6284   2N6287  
2N6387   2N6388  
2N6487   2N6488  
2N6489   2N6490  
2N6668   2SA1802  
2SA1930   2SA1943  
2SA1962   2SA1986  
2SA1987   2SC1837  
2SC5171   2SC5200  
2SC5242   2SC5358  
2SC5359   FMB2222A  
FMB2907A   MAT02  
MAT03   MJ15003  
MJE15028   MJE15032  
MJE340   MJE350  
TIP140   TIP145  
TIP29   TIP2955  
TIP3055   TIP31V  
TIP33   TIP35  
TIP36   TIP41  
TIPP31  

Triacs
BR100   BRY56  
BRY61   BRY62  
BT137   BT138  
BT139   BTA04  
BTA06B   BTA06BW  
BTA06GP   BTA06T  
BTA08B   BTA08S  
BTA10B   BTA10GP  
BTA12B   BTA16B  
BTA25   BTA26AB  
BTA40AB   BTA41AB  
BTB24   T0505  
T0509   T0510  
T0512   T0605  
T0609   T0610  
T0612   T0805  
T0809   T0810  
T0812   T10  
T12   T16  
T25   T25K  
T40K   TIC106  
TIC108   TIC116  
TIC126   TIC206  
TIC216   TIC225  
TIC226   TIC236  
TIC246   TICP106  

74 XXX
7400   7402  
7403   7404  
7405   7406  
7407   7408  
7410   74107  
7411   74112  
7412   74121  
74123   74125  
7413   74132  
74138   74139  
7414   74147  
74151   74158  
74159   74160  
74164   74165  
74166   7417  
74190   74192  
74194   74195  
7420   7421  
74221   74240  
74241   74242  
74245   74251  
74257   74259  
74266   7427  
74273   7428  
7430   7432  
74373   74374  
7438   74390  
74393   7442  
7447   74540  
74544   74545  
74573   74574  
74688   7473  
7474   7475  
7485   7486  
7493  

40 XXX
4000  4007 
4009  40102 
40106  4011 
4013  4015 
4016  40160 
4017  40174 
40175  40192 
40194  4020 
4027  4028 
4029  4030 
4035  4040 
4041  4042 
4043  4046 
4047  4049 
4051  4060 
4066  4067 
4068  4069 
4070  4071 
4073  4077 
4078  4081 
4093  4098 
4099  4511 
4514  4518 
4528  4538 
4543  4555 
4585  4724 

Microcontrollers
  Atmel:
89C1051  89C2051  
89C51   89C52  
89C55   89INSTR  
89S8252   90LS2323  
90LS2343   90LS4434  
90LS8535   90S1200  
90S2313   90S2323  
90S2343   90S4414  
90S4434   90S8515  
90S8535   AVRINSTR  
MEGA103   MEGA103L  
MEGA603   MEGA603L
  PIC:
12C509   12C672  
12CE518   12CE519  
12CE674   16C52  
16C54S   16C55S  
16C56S   16C57S  
16C58S   16C64B  
16C71   16C710  
16C711   16C715  
16C84   16CR54S  
16CR56S   16CR57S  
16CR58S   16CR83  
16CR84   16F83  
16F84  
  Philips:
8051ARCH   8051EPRO  
8051HARD   8051PROG  
80C31   80C32  
80C451   80C550  
80C552   83C451  
83C550   83C552  
83C750   83C751  
83C752   83C754  
87C451   87C550  
87C552   87C652  
87C750   87C751  
87C752   87C754  
8XC51   8XC52  
8XC54   8XC58  
  Siemens:
80515   80C515  
80C515A   80C517  
80C517A   80C537  
83C166   83C515A  
  ADSP:
2101   2103  
2105   21061  
21062   2111  
2115   2161  
2162   2163  
2164   2171  
2172   2173  
2181   2185  
2185L   2186  
2186L   2187L  
21OVER  
  ST:
ST6208C   ST6209C  
ST6210C   ST6215C  
ST6220C   ST6225C  
ST6255C   ST6265C  
ST72101   ST72121  
ST72212   ST72213  
ST72251   ST72272  
ST72311   ST72331  
ST72371   ST72372  
ST72671   ST72751  
ST72752   ST7277  
ST7_OVER  
  Motorola:
HC705E1   HC705JB3  
HC705KJ   HC705L5  
HC705PL   HC705PLB  
HC705X   HC705XX7  
HLC705KJ   HRC705KJ  
HC05B   HC05BD3  
HC05BD5   HC05DX  
HC05JB3   HC05KJ  
HC05L5   HC05PL  
HC05PLB   HC05X  
HC705BD3   HC705BD7  
HC705C8   HC705C9  
HC705DX   HC08  
HC08A   HC708MP  
708AZ60   908AZ60  
HC11E   HC11F1  
HC11D3  
  Scenix:
18AC   18AC100  
18AC75   20AC  
20AC100   20AC75  
28AC   28AC100  
28AC75   28ACINF  
SX28AC75   SX48  
SX48_52   SX52  
  EEprom:
24128-B   24128  
24256-A   24256-B  
24256   24C01  
24C02   24C04  
24C08   24C16  
24C32   24C64  
93C46   93C47  
93C56   93C57  
X24321   X24640  
X24641   X24645  
  Eprom:
27128   2716  
27256   2732  
27512   2764  
27C1001   27C1024  
27C160   27C2001  
27C202   27C256B  
27C320   27C322  
27C400   27C4001  
27C4002   27C405  
27C512   27C516  
27C64   27C800  
27C801   27V101  
27V102   27V160  
27V201   27V256  
27V401   27V402  
27V405   27V512  
27V800   27V801  
87C257  
  RAM:
K4F661611C   K4F661612C  
K4F661612D   K4F640411C  
K4F640412C   K4F640811C  
K4F640812C   K4F640812D  
K4F641611C   K4F641612C  
K4F641612D   K4F660411C  
K4F660412C   K4F660811C  
K4F660812C   K4F660812D  
HM5165405F   HM5165805  
HM5112805   HM5113805  
HM5164165   HM5164405F  
HM5164805   HM5165165  
HB56UW1673E   HB56UW3272  
HB52E169   HB52E649E12  
HB52F88EM   HB52F89EM  
HB52F168EN   HB52F169  
HB52F169EN   HB52F649E1  
HB52R329   HB52R1289  
HB52R2569E2   HB52RD328  
HB52RF329E2   HB52RF1289  
HB54A2569   HB54A5129  
K4E661612D   K4E640411C  
K4E640412C   K4E640412D  
K4E640811C   K4E640812C  
K4E640812D   K4E641611C  
K4E641612C   K4E641612D  
K4E660411C   K4E660412C  
K4E660412D   K4E660811C  
K4E660812C   K4E660812D  
K4E661611C   K4E661612C  
HM5425401B   HM5425801B  
HM5212165F   HM5212805F  
HM5225165B   HM5225325F  
HM5225405B   HM5225645F  
HM5225805B   HM5251165B  
HM5251405B   HM5251805B  
HM5264165   HM5264405  
HM5264805   HM5425161B  
628511H   6216255H  
62W1400H   62W4100H  
62W8511H   62W16255H  
621400H   624100H  
628512B   628512BI  
62V8512B   62V16256B  
62V16258B   62W8512B  
62W8512BI   62W16256B  
62W16258B   6264B  
6264BI   62256B  
628128D   628128DI  
658512A   67S36130  
62G18256   62G36128  
62G36256  

Electronics. Modelling, Analysis and Design. Physical Process Modeling Team:
SOLID STATE DC DRIVES
DC MOTORS FUNDAMENTALS AND MECHANICAL SYSTEMS
DC motor- Types, induced emf, speed-torque relations; Speed control - Armature and field speed control;
Ward Leonard control - Constant torque and constant horse power operation - Introduction to high speed drives and modern drives.
Characteristics of mechanical system - dynamic equations, components of torque, types of load;
Requirements of drives characteristics - multi-quadrant operation; Drive elements, types of motor duty and selection of motor rating.
CONVERTER CONTROL
Principle of phase control - Fundamental relations; Analysis of series and separately excited DC motor with single-phase and three-phase
converters - waveforms, performance parameters, performance characteristics.
Continuous and discontinuous armature current operations; Current ripple and its effect on performance;
Operation with free wheeling diode; Implementation of braking schemes; Drive employing dual converter.
CHOPPER CONTROL
Introduction to time ratio control and frequency modulation; Class A, B, C, D and E chopper controlled DC motor - performance analysis,
multi-quadrant control - Chopper based implementation of braking schemes; Multi-phase chopper; Related problems.
CLOSED LOOP CONTROL
Modeling of drive elements - Equivalent circuit, transfer function of self, separately excited DC motors; Linear Transfer function model
of power converters; Sensing and feeds back elements - Closed loop speed control - current and speed loops, P, PI and PID controllers -
response comparison. Simulation of converter and chopper fed d.c drive.
DIGITAL CONTROL OF D.C DRIVE
Phase Locked Loop and micro-computer control of DC drives - Program flow chart for constant horse power and load disturbed operations; Speed detection and gate firing.
SOLID STATE AC DRIVES
INTRODUCTION TO INDUCTION MOTORS
Steady state performance equations - Rotating magnetic field - torque production, Equivalent circuit- Variable voltage,
constant frequency operation - Variable frequency operation, constant Volt/Hz operation. Drive operating regions, variable stator
current operation, different braking methods.
VSI AND CSI FED INDUCTION MOTOR CONTROL
AC voltage controller circuit - six step inverter voltage control-closed loop variable frequency PWM inverter with dynamic braking-CSI fed
IM variable frequency drives comparison.
ROTOR CONTROLLED INDUCTION MOTOR DRIVES
Static rotor resistance control - injection of voltage in the rotor circuit - static scherbius drives - power factor considerations - modified Kramer drives.
FIELD ORIENTED CONTROL
Field oriented control of induction machines - Theory - DC drive analogy - Direct and Indirect methods -
Flux vector estimation - Direct torque control of Induction Machines - Torque expression with stator and rotor fluxes, DTC control strategy.
SYNCHRONOUS MOTOR DRIVES
Wound field cylindrical rotor motor - Equivalent circuits - performance equations of operation from a voltage source -
Power factor control and V curves - starting and braking, self control - Load commutated Synchronous motor drives - Brush and Brushless excitation.
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processmodeling.org  



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Heat transfer  
TRANSFORMER

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  In discussion of the other basic materials, iron and copper, mention has already
been made of the energy losses which their use entails. These, of course,
manifest themselves in the form of heat. This results in a rise in temperature
of the system, be it core and windings, core frames, tank, or other ancillary
parts. These will reach an equilibrium when the heat is being taken away
as fast as it is being produced. For the great majority of transformers, this
limiting temperature is set by the use of paper insulation, which, if it is to
have an acceptable working life, must be limited to somewhere in the region
of 100°C. Efficient cooling is therefore essential, and for all but the smallest
transformers, this is best provided by a liquid.
  For most transformers mineral oil is the most efficient medium for absorbing
heat from the core and the windings and transmitting it, sometimes aided by
forced circulation, to the naturally or artificially cooled outer surfaces of the
transformer. The heat capacity, or specific heat, and the thermal conductivity
of the oil have an important influence on the rate of heat transfer.
  When the resistive and other losses are generated in transformer windings
heat is produced. This heat must be transferred into and taken away by the
transformer oil. The winding copper retains its mechanical strength up to
several hundred degrees Celsius. Transformer oil does not significantly degrade
below about 140oC, but paper insulation deteriorates with greatly increasing
severity if its temperature rises above about 90oC. The cooling oil flow must,
therefore, ensure that the insulation temperature is kept below this figure as far as possible.
  The maximum temperature at which no degradation of paper insulation
occurs is about 80oC. It is usually neither economic nor practical, however,
to limit the insulation temperature to this level at all times. Insulation life
would greatly exceed transformer design life and, since ambient temperatures
and applied loads vary, a maximum temperature of 80oC would mean that on
many occasions the insulation would be much cooler than this. Thus, apart
from premature failure due to a fault, the critical factor in determining the
life expectancy of a transformer is the working temperature of the insulation
or, more precisely, the temperature of the hottest part of the insulation or hot
spot. The designer’s problem is to decide the temperature that the hot spot
should be allowed to reach. Various researchers have considered this problem
and all of them tend to agree that the rate of deterioration or ageing of paper
insulation rapidly increases with increasing temperature.
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PCB

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  Figure 1   Figure 1
  In situ measurements of conditions such as temperature can be used to infer
the quality of the wafers being produced in thermal processes. In many types
of thermal processing equipment, temperature is measured using a thermocouple
embedded in the wafer holder (or susceptor). A thermocouple is a circuit consisting
of a pair of wires made of different metals joined at one end (the “sensing
junction”) and terminated at the other end (the “reference junction”) in such a
way that the terminals are both at a known reference temperature. Leads from
the reference junction to a load resistance (i.e., an indicating meter) complete
the thermocouple circuit. Due to the thermoelectric effect (or Seebeck effect), a
current is induced in the circuit whenever the sensing and reference junctions are
different temperatures. This current varies linearly with the temperature difference
between the junctions.
  In some cases (such as in rapid thermal processes), the use of a thermocouple
is not possible because there is no susceptor. Alternative temperature sensors
used in such situations include thermopiles and optical pyrometers. A thermopile,
which also operates via the Seebeck effect, consists of several sensing junctions
made of the same material pairs located in close proximity and connected in
series in order to multiply their output.
  The second alternative method to the thermocouple is pyrometry. Pyrometers
operate by measuring the radiant energy received in a certain band of energies,
assuming that the source is a graybody of known emissivity. The input energy can
then be converted to a source temperature using the Stefan–Boltzmann relationship.
Most commercial systems monitor the mid-infrared band (3–6 m).
  One major issue in using pyrometry is that the effective emissivity of the source
must be accurately known. The effective emissivity includes both intrinsic and
extrinsic contributions. Intrinsic emissivity is a function of the material, surface
finish, temperature, and wavelength. Extrinsic emissivity is affected by the amount
of radiant energy from other sources reflected back to the spot being measured
(which can increase the apparent temperature). In addition, the presence of multiple
layers of different thin-film materials can also alter the apparent emissivity
due to interference effects.
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RESISTOR

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    Figure 1
  Measurement, or measuring, is also the most important part of an experiment.
Measuring is not absolute, as it does not define a quantity (standard) to be measured.
Measuring is a relative effort and is made to compare and to evaluate. To be independent,
a comparison requires a measure, a standard unit.
  The art of measuring is at least as old as humanity itself. The human body performs
measurements all the time. One of the most basic quantities continuously measured by
the human body is the environment temperature. Feeling hot or cold is a consequence
of this measuring. Although not descriptive (not quantified with a parameter such as
temperature), the natural measuring of the environmental temperature by the human
body is nevertheless a relative process. This process is based on a comparison of the
environmental temperature with a certain standard, in this case the temperature at
which the body feels neitherhot norcold—the null point of human thermal control.
In heat transfer, temperature and heat flow are unquestionably the most important
quantities to be measured. Other quantities of interest to heat transfer include fluid
speed, pressure (force), mechanical stress, electric current, voltage, length, surface
area, volume, and displacement. In this chapter the focus is on temperature and heat
flow measurements.
  General measuring concepts such as sensitivity, hysteresis, calibration, accuracy,
and readability are presented first. Then the discussion turns to statistical concepts
such as mean, deviation, standard deviation, normal distribution, Chauvenet’s criterion,
and the chi-square test, related to the determination of precision, bias error, and
measuring uncertainty. The final section of this chapter is devoted to a brief discussion
of some common instruments for measuring temperature or heat flow.
  Among the two possible alternatives for sensing devices, the most common are the
contact sensing devices such as thermocouples that measure by physical contact. In
general, contact sensing devices are rugged, economical, relatively accurate, and easy
to use. Disadvantages commonly associated with contact sensing devices include
susceptibility to wear (e.g., breaking of thermocouple junction). They also require
accessibility forphysical contact. Because of the contact nature of these devices,
they tend to interfere with the medium where measurement is to be taken, frequently
affecting the state and the value of the quantity to be measured. The last disadvantage
can be a serious problem. For instance, the conductive wires of a thermocouple
will always provide a heat path when in contact with the medium where temperature
is to be measured. This heat path can modify the state of the medium where
temperature is to be measured by adding energy to, or extracting energy from, the medium.
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TRANSISTOR

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  Natural convection is generated by the density difference induced by the temperature differences
within a fluid system. Because of the small density variations present in these types
of flows, a general incompressible flow approximation is adopted. In most buoyancy-driven
convection problems, flow is generated by either a temperature variation or a concentration
variation in the fluid system, which leads to local density differences. Therefore, in such
flows, a body force term needs to be added to the momentum equations to include the effect
of local density differences.
  Mixed convection involves features from both forced and natural flow conditions. The
buoyancy effects become comparable to the forced flow effects at small and moderate
Reynolds numbers. Since the flow is partly forced, a reference velocity value is normally
known (Example: velocity at the inlet of a channel). Therefore, non-dimensional scales
of forced convection can be adopted here. However, in mixed convection problems, the
buoyancy term needs to be added to the appropriate component of the momentum equation.
If we replace 1/P r with Re in the non-dimensional natural convection equations of the
previous subsection, we obtain the non-dimensional equations for mixed convection flows.
These equations are the same as for the forced convection flow problem except for the
body force term, which will be added to the momentum equation in the gravity direction.
  Forced convection heat transfer is induced by forcing a liquid, or gas, over a hot body or
surface. Two forced convection problems will be studied in this section. The first problem
is the extension of flow through a two-dimensional channel as discussed in the previous
section and the second one is of forced convection over a sphere. The difference between
the first problem and the one in the previous section is that the top and bottom walls are
at a higher temperature than that of the air flowing into the channel.
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  Movie - force convection heat flux
  Many physical situations involve the transfer of heat in a material by conduction and its
subsequent dissipation by exchange with a fluid or the environment by convection. The
heat sinks used in the electronic industry to dissipate heat from electronic components to
the ambient are an example of a conduction–convection system. Other examples include
the dissipation of heat in electrical windings to the coolant, the heat exchange process in
heat exchangers and the cooling of gas turbine blades in which the temperature of the
hot gases is greater than the melting point of the blade material. In Section 3.6, we have
already demonstrated the applications of the finite element method for extended surfaces
with different cross sections. Also, the problems discussed in the previous section of this
chapter include the influence of convective boundary conditions. However, all the problems
studied previously in this chapter assumed that the domains were of infinite length.
Figure 1 shows various types of fins used in practice. Let us now consider the case
of a tapered fin (extended surfaces) with plane surfaces on the top and bottom. The fin
also loses heat to the ambient via the tip. The thickness of the fin varies linearly from t2 at
the base to t1 at the tip as shown in Figure 2 The width, b, of the fin remains constant
along the whole length.
  In Figure 1 and Figure 2, we have discussed steady state heat conduction in which the
temperature in a solid body was assumed to be invariant with respect to time. However,
many practical heat transfer applications are unsteady (transient) in nature and in such
problems the temperature varies with respect to time. For instance, in many components
of industrial plants such as boilers, refrigeration and air-conditioning equipment, the heat
transfer process is transient during the initial stages of operation. Other transient processes
include crystal growth, casting processes, drying, heat transfer associated with the earth’s
atmosphere, and many more. It is therefore obvious that the analysis of transient heat
conduction is very important.
  Analytical techniques such as variable separation, which are employed to solve transient
heat conduction problems, are of limited use (Ozisik 1968), and a solution for practical heat
transfer problems by these methods is difficult. Thus, it is essential to develop numerical
solution procedures to solve transient heat conduction problems.
  Heat conduction solutions for many geometric shapes of practical interest cannot be found
using the charts available for regular geometries (Holman 1989). Because of the timedependent
boundary, or interface conditions, prevalent in many transient heat conduction
problems, analytical or lumped solutions are also difficult to obtain. In such complex
situations, it is essential to develop approximate time-stepping procedures to determine the
transient temperature distribution.
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Rationale:
Over the past few decades, major advances in the applications & control of electric machinery have occurred as a result of advances in power electronics & microprocessor based control systems. Consequently a much broader spectrum of Electric Machine types can be found in modern applications. This course provides an introduction to the theory of Electro-Mechanical devices & gives emphasis on a physical understanding of fundamental principles behind the operation of Electric Machines.
Polyphase Circuits: Review of Polyphase Circuits, Balanced & Unbalanced Loads, Unbalanced Delta Connected Load, Three Phase Three Wire & Three Phase Four Wire Star Connected Unbalanced Load, Millman's Theorem, Delta/Star & Star/Delta Conversion
Transformers: EMF Equation, Phasor Diagram & Equivalent Circuit, Determination of Losses by Open Circuit Test and Short Circuit Test, Sumpner's Test, Regulation & Efficiency, Special Constructional Features of Three Phase Transformers, Connections, Labeling of Terminals, Specifications, , Phase Groups, Harmonics & Transients , Parallel Operation, Three Winding Transformers, Phase Conversion, On Load Tap Changers, Ratio And Polarity Tests, Phasing Out Test, Instrument Transformers: Theory, expression for ratio and phase angle errors, design consideration and testing
Auto Transformer, Pulse Transformer, Isolation Transformer
DC Generators: Constructional Features, Basic Principle of Working, EMF Equation, Armature Windings, Types, Characteristics and Applications, Armature Reaction, Commutation
DC Motors: Principles of Working, Significance of Back Emf, Torque Equation, Separately & Self Excited Motors, Characteristics and Selection of DC Motors for Various Applications, Starting, Speed Control, Various Tests to find Losses and Efficiency
References:
(1) M.G. Say,Performance & design of AC machines, CBS publishers & distributors, Delhi, 3rd edition
(2) A.E. Clayton & N.N. Nancock, The Performance & design of DC machines CBS publications & distributors, Delhi, 3rd edition
(3) Nagrath I.J.& Kothari D. P., Electric Machines, Tata McGraw Hill , New Delhi, 2nd edition
(4) Bharat Heavy Electricals Ltd, Transformers, Tata McGraw Hill
(5) Syed A. Nasar,Electric Machines & Power Systems, Volume I , Tata McGraw Hill, New Delhi
(6) A. E. Fitzerald & C. Kingsley & S.D. Umans , Electric Machinery Tata McGraw Hill ,New Delhi ,5th edition
(7)Dr. P.S. Bhimbra, Generalized theory of Electrical Machines, Khanna publishers, Delhi, 5th edition
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